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PRELIMINARY
RMPA2266 i-LoTM WCDMA Band I Power Amplifier Module
April 2007
RMPA2266 i-LoTM
WCDMA Band I Power Amplifier Module
Features
40% WCDMA efficiency at +28dBm Pout 20% WCDMA efficiency (58mA total current) at
tm
General Description
The RMPA2266 Power Amplifier Module (PAM) is Fairchild's latest innovation in 50 matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the call for ultra-low DC power consumption and extended battery life in portable electronics, the RMPA2266 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (< +16dBm), where the handset most often operates. A simple two-state Vmode control is all that is needed to reduce operating current by more than 60% at 16dBm output power, and quiescent current (Iccq) by as much as 70% compared to traditional power-saving methods. No additional circuitry, such as DC-to-DC converters, are required to achieve this remarkable improvement in amplifier efficiency. Further, the 4 x 4 x 1.0mm LCC package is pin-compatible and a drop-in replacement for last generation 4 x 4mm PAMs widely used today, minimizing the design time to apply this performance-enhancing technology. The multi-stage GaAs Microwave Monolithic Integrated Circuit (MMIC) is manufactured using Fairchild RF's InGaP Heterojunction Bipolar Transistor (HBT) process.
+16dBm Pout
Low quiescent current (Iccq): 25mA in low-power
mode
Meets UMTS/WCDMA performance requirements Meets HSDPA performance requirements Single positive-supply operation with low power and
shutdown modes - 3.4V typical Vcc operation - Low Vref (2.85V) compatible with advanced handset chipsets Compact Lead-free compliant LCC package - (4.0 x 4.0 x 1.0mm nominal) Industry standard pinout Internally matched to 50 and DC blocked RF input/output
Functional Block Diagram
(Top View) MMIC
Vcc1 1 RF IN GND Vmode Vref
10 Vcc2
INPUT MATCH OUTPUT MATCH BIAS/MODE SWITCH
2 3 4 5
9 GND 8 RF OUT 7 GND 6 GND
11 (paddle ground on package bottom)
(c)2007 Fairchild Semiconductor Corporation RMPA2266 i-LoTM Rev. D
www.fairchildsemi.com
PRELIMINARY
RMPA2266 i-LoTM WCDMA Band I Power Amplifier Module
Absolute Ratings(1)
Symbol
Vcc1, Vcc2 Vref Vmode Pin Tstg Supply Voltages Reference Voltage Power Control Voltage RF Input Power Storage Temperature
Parameter
Ratings
5.0 2.6 to 3.5 3.5 +10 -55 to +150
Units
V V V dBm C
Note: 1. No permanent damage with only one parameter set at extreme limit. Other parameters set to typical values.
Electrical Characteristics(2)
Symbol
f Gp Po PAEd Itot WCDMA OPERATION Power Gain Linear Output Power PAEd (digital) @ 28dBm PAEd (digital) @ 16dBm High Power Total Current Low Power Total Current Adjacent Channel Leakage Ratio ACLR1 ACLR2 5.00MHz Offset 10.0MHz Offset Po = +28dBm, Vmode = 0V Po = +16dBm, Vmode 2.0V Vmode = 0V Vmode 2.0V Vmode = 0V Vmode 2.0V Po = +28dBm, Vmode = 0V Po = +16dBm, Vmode 2.0V WCDMA Modulation 3GPP 3.2 03-00 DPCCH+1 DCDCH Po = +28dBm, Vmode = 0V Po = +16dBm, Vmode 2.0V Po = +28dBm, Vmode = 0V Po = +16dBm, Vmode 2.0V GENERAL CHARACTERISTICS VSWR Rx No 2fo 3fo-5fo S Tc Iccq Iref Icc(off) Input Impedance Receive Band Noise Power Harmonic Suppression Harmonic Suppression Spurious Outputs
(3)(4)
Parameter
Operating Frequency
Comments
Min.
1920
Typ.
Max.
1980
Units
MHz dB dB dBm dBm
28 22 28 16 40 20 460 58
% % mA mA
-40 -42 -52 -57 2.0:1 2.5:1
dBc dBc dBc dBc
Po +28dBm, 2110 to 2170MHz Po +28dBm Po +28dBm Load VSWR 5.0:1 -30 Vmode 2.0V Po +28dBm No applied RF signal
-136 -38 -55 -60 10:1 85 25 5 1 5
dBm/Hz dBc dBc dBc C mA mA A
Ruggedness with Load Mismatch (4) No permanent damage Case Operating Temperature Quiescent Current Reference Current Shutdown Leakage Current DC CHARACTERISTICS
Notes: 2. All parameters met at Tc = +25C, Vcc = +3.4V, Vref = 2.85V and load VSWR 1.2:1, unless otherwise noted. 3. All phase angles. 4. Guaranteed by design.
(c)2007 Fairchild Semiconductor Corporation RMPA2266 i-LoTM Rev. D
www.fairchildsemi.com 2
PRELIMINARY
RMPA2266 i-LoTM WCDMA Band I Power Amplifier Module
Recommended Operating Conditions
Symbol
f Vcc1, Vcc2 Vref Supply Voltage Reference Voltage Operating Shutdown Bias Control Voltage Low-Power High-Power Linear Output Power High-Power Low-Power Case Operating Temperature -30
Parameter
Operating Frequency
Min.
1920 3.0 2.7 0 1.8 0
Typ.
3.4 2.85
Max.
1980 4.2 3.1 0.5 3.0 0.5 +28
Units
MHz V V V V V dBm dBm C
Vmode
2.0
Pout
+16 +85
Tc
DC Turn On Sequence:
1. Vcc1 = Vcc2 = 3.4V (typical) 2. Vref = 2.85V (typical) 3. High-Power: Vmode = 0V (Pout > 16dBm) Low-Power: Vmode = 2.0V (Pout < 16dBm)
(c)2007 Fairchild Semiconductor Corporation RMPA2266 i-LoTM Rev. D
www.fairchildsemi.com 3
PRELIMINARY
RMPA2266 i-LoTM WCDMA Band I Power Amplifier Module
Evaluation Board Layout
1 5 3 6 6 5
2
2266
XYTT
Z
4
7 5
Materials List
Qty
1 2 5 Ref 3 3 2 1 1 A/R A/R
Item No.
1 2 3 4 5 5 (Alt) 6 7 7 (Alt) 8 9
Part Number
G657553-1 V2 #142-0701-841 #2340-5211TN GRM39X7R102K50V ECJ-1VB1H102K C3216X5R1A335M GRM39Y5V104Z16V ECJ-1VB1C104K SN63 SN96
Description
PC Board SMA Connector Terminals Assembly, RMPA2266 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3F Capacitor (1206) 0.1F Capacitor (0603) 0.1F Capacitor (0603) Solder Paste Solder Paste
Vendor
Fairchild Johnson 3M Fairchild Murata Panasonic TDK Murata Panasonic Indium Corp. Indium Corp.
Evaluation Board Schematic
3.3 F VCC1 SMA1 RF IN VMODE VREF 1000 pF 0.1 F 50 Ohm TRL 4 5 11 (PACKAGE BASE) 1000 pF 1 2 10 1000 pF 3.3 F VCC2 50 Ohm TRL SMA2 RF OUT
2266
XYTT
8
Z
3, 6, 7, 9
(c)2007 Fairchild Semiconductor Corporation RMPA2266 i-LoTM Rev. D
www.fairchildsemi.com 4
PRELIMINARY
RMPA2266 i-LoTM WCDMA Band I Power Amplifier Module
Package Outline
I/O 1 INDICATOR TOP VIEW 1 2 10 9
2266
XYTT
(4.00mm +.100 ) SQUARE -.050
3 4 5
8
6
1.1mm MAX. FRONT VIEW .25mm TYP. 3.50mm TYP. See Detail A .40mm .30mm TYP. .85mm TYP. 11 2 1 1.08mm 1.84mm BOTTOM VIEW .18mm DETAIL A. TYP. 3.65mm .10mm .10mm .40mm .45mm
Signal Descriptions
Pin #
1 2 3 4 5 6 7 8 9 10 11
Signal Name
Vcc1 RF In GND Vmode Vref GND GND RF Out GND Vcc2 GND
Description
Supply Voltage to Input Stage RF Input Signal Ground High Power/Low Power Mode Control Reference Voltage Ground Ground RF Output Signal Ground Supply Voltage to Output Stage Paddle Ground
(c)2007 Fairchild Semiconductor Corporation RMPA2266 i-LoTM Rev. D
5
ZT T XY 2 6 6
www.fairchildsemi.com
2
Z
7
PRELIMINARY
RMPA2266 i-LoTM WCDMA Band I Power Amplifier Module
Applications Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE. Precautions to Avoid Permanent Device Damage: * Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. Devices should remain in their original packaging until component placement to ensure no contamination or damage to RF, DC and ground contact areas. * Device Cleaning: Standard board cleaning techniques should not present device problems provided that the boards are properly dried to remove solvents or water residues. * Static Sensitivity: Follow ESD precautions to protect against ESD damage: - A properly grounded static-dissipative surface on which to place devices. - Static-dissipative floor or mat. - A properly grounded conductive wrist strap for each person to wear while handling devices. * General Handling: Handle the package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoiding damaging the RF, DC, and ground contacts on the package bottom. Do not apply excessive pressure to the top of the lid. * Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this condition, devices are protected and require no special storage conditions. Once the sealed bag has been opened, devices should be stored in a dry nitrogen environment. Device Usage: Fairchild recommends the following procedures prior to assembly. * Assemble the devices within 7 days of removal from the dry pack. * During the 7-day period, the devices must be stored in an environment of less than 60% relative humidity and a maximum temperature of 30C * If the 7-day period or the environmental conditions have been exceeded, then the dry-bake procedure per JEDEC J-STD-020 must be performed. Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. Reflow Profile * Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A maximum heating rate is 3C/sec. * Pre-heat/soak: The soak temperature stage serves two purposes; the flux is activated and the board and devices achieve a uniform temperature. The recommended soak condition is: 60-180 seconds at 150-200C. * Reflow Zone: If the temperature is too high, then devices may be damaged by mechanical stress due to thermal mismatch or there may be problems due to excessive solder oxidation. Excessive time at temperature can enhance the formation of inter-metallic compounds at the lead/board interface and may lead to early mechanical failure of the joint. Reflow must occur prior to the flux being completely driven off. The duration of peak reflow temperature should not exceed 20 seconds. Soldering temperatures should be in the range 255-260C, with a maximum limit of 260C. * Cooling Zone: Steep thermal gradients may give rise to excessive thermal shock. However, rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of the heat sink to the PWB. The solder joint should be 95% void-free and be a consistent thickness. Rework Considerations: Rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no more than 5 seconds. No more than 2 rework operations should be performed.
Recommended Solder Reflow Profile
260
Ramp-Up Rate 3 C/sec max
Peak temp 260 +0/-5 C 10 - 20 sec
Temperature (C)
217 200
Time above liquidus temp 60 - 150 sec
150
Preheat, 150 to 200 C 60 - 180 sec
100
Ramp-Up Rate 3 C/sec max
50 25
Time 25 C/sec to peak temp 6 minutes max
Ramp-Down Rate 6 C/sec max
Time (Sec)
(c)2007 Fairchild Semiconductor Corporation RMPA2266 i-LoTM Rev. D
www.fairchildsemi.com 6
PRELIMINARY
RMPA2266 i-LoTM WCDMA Band I Power Amplifier Module
TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Across the board. Around the world. ActiveArray Bottomless Build it Now CoolFET CROSSVOLT CTLTM Current Transfer LogicTM DOME 2 E CMOS (R) EcoSPARK EnSigna FACT Quiet SeriesTM (R) FACT (R) FAST FASTr FPS (R) FRFET GlobalOptoisolator GTO
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DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
Rev. I24
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
No Identification Needed
Full Production
Obsolete
Not In Production
(c)2007 Fairchild Semiconductor Corporation RMPA2266 i-LoTM Rev. D
www.fairchildsemi.com 7

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